MECH-EL / MEI 829

The Mech-El/MEI 829 is designed for thermosonic and thermocompression ball bonding of IC's, hybrids, microwave, laser diodes, and other devices using gold wire from 0.7 mil to 3 mil  in size.

SPECIFICATIONS: 

Bonding Processes: Thermocompression or thermosonic ball bonding using gold wire.
Wire sizes:  1 mil (25 micron) wire standard.  0.7 mil (18 micron), 2 mil (51 micron), and 3 mil (76 micron)
capability available.
Tip Weight: 15 - 150 grams.
Capillary size: 0.063" x 0.375" (1.6mm x 9.5 mm) standard.
Heated Workstage: Digital heat control option will regulate temperature from ambient to 300C +/- 0.5% (dependant
upon application).
Ultrasonics: Uthe 10G generator with 25ST transducer standard.
Micropositioner: 6:1 standard.  
Services: Electrical: 110-115 VAC, 50/60Hz, 5 amps or 220-240 VAC, 50/60Hz, 2.5 amps. Air: 40 PSI (240 kPa)
                minimum, if required.
Vacuum: 20" (510 mm) Hg minimum, if required.
Dimensions:   Length: 
Width: 18" (45.7cm)
Height 17.75" (45.1cm)
Net Weight: 40 pounds (18 Kg)

*Note: Exact dimensions are dependent upon the options on the machine.